Deck 31: Electronics Assembly and Packaging

Question 1

The first level of packaging refers to which one of the following:

A)Chip-to-package interconnections to form an IC package
B)circuit board to rack
C)IC package to printed circuit board
D)intraconnections on the IC chip
E)wiring and cabling connections in the cabinet

Answer 1

Chip-to-package interconnections to form an IC package

Question 2

Surface-mount technology is used at which one of the following packaging levels:

A)zero
B)first
C)second
D)third
E)fourth

Answer 2

second

Question 3

Card-on-board (COB) packaging refers to which one of the following packaging levels:

A)zero
B)first
C)second
D)third
E)fourth

Answer 3

third

Question 4

Which of the following polymeric materials is commonly used as an ingredient in the insulation layer of a printed circuit board (two correct answers):

A)copper
B)E-glass
C)epoxy
D)phenolic
E)polyethylene
F)polypropylene

Question 5

Typical thickness of the copper layer in a printed circuit board is which one of the following:

A)4 mm (0.160 in)
B)0.4 mm (0.016 in)
C)0.04 mm (0.0016 in)
D)0.004 mm (0.00016 in)

Question 6

Several types of holes must be created in a printed circuit board prior to assembly.Which one of the following hole types is not required when surface mount components are assembled to the board:

A)insertion holes
B)tooling holes
C)via holes

Question 7

Which of the following plating processes has the higher deposition rate in PCB fabrication:

A)electroless plating
B)electroplating

Question 8

In addition to copper, which one of the following is another common metal plated onto a PCB:

A)aluminum
B)gold
C)nickel
D)tin

Question 9

In the subtractive circuitization method used to transform a copper-clad board into a printed circuit board, portions of the copper cladding that are coated with resist are etched away so that the tracks and lands of the desired circuit remain:

Question 10

The solder paste and reflow soldering method of affixing components in surface-mount technology includes a wave soldering step to securely attach the components to the board:

Question 11

In the solder paste and reflow soldering method of affixing components in surface-mount technology, the methods of applying the solder paste to the surface of the printed circuit board include which of the following (two best answers):

A)automated placement machines
B)hand painting
C)photolithography
D)screen printing
E)semiautomatic placement machines
F)syringe dispensing

Question 12

In the adhesive bonding and wave soldering method of affixing components in surface-mount technology, the components themselves pass through the molten solder wave:

Question 13

Which of the following are the soldering processes used to attach components to printed circuit boards in through-hole technology (two best answers):

A)hand soldering
B)infrared soldering
C)reflow soldering
D)torch soldering
E)wave soldering

Question 14

In general, which of the following technologies causes more problems during rework:

A)surface-mount technology
B)through-hole technology

Question 15

Hand soldering is sometimes used after wave soldering in the solder paste and reflow soldering method to add delicate components that would be damaged in the harsh environment of the wave-soldering chamber:

Question 16

Which of the following electrical connection methods produce a separable connection (two correct answers):

A)crimping of terminals
B)press fitting
C)soldering
D)terminal blocks
E)sockets