Deck 6: Supporting Processors

Question 1

A ____ is a heat sink carrying an electrical charge that causes it to act as an electrical thermal transfer device.

A)Moirre
B)peltier
C)pelted
D)perrier

Answer 1

B

Question 2

The most popular method of cooling overclocked processors is a(n)____.

A)air boosted system
B)peltier system
C)liquid cooling system
D)heat pipe system

Answer 2

C

Question 3

Installing more than one processor on a motherboard creates a ____.

A)multiprocessor platform
B)wide platform
C)variable platform
D)uniprocessor platform

Answer 3

A

Question 4

Processor core frequency is measured in ____.

A)hertz
B)megahertz
C)gigahertz
D)terahertz

Question 5

Memory on the processor die is called ____ cache.

A)Level 1
B)Level 2
C)Level 3
D)Level 4

Question 6

If a power-on password has been forgotten,you can use the BIOS ____ to reset the password.

A)jumper pad
B)jumper group
C)solder group
D)solder pads

Question 7

The peltier's top surface can be as hot as ____ degrees F.

A)45
B)150
C)375
D)500

Question 8

____ hold counters,data,instructions,and addresses that the ALU is currently processing.

A)Logic units
B)Caches
C)Registers
D)Shifters

Question 9

Using the ____ technology,the Intel processor,chipset,and wireless network adapter are all interconnected as a unit,which improves laptop performance.

A)Centrino
B)Core
C)vPro
D)Centrum

Question 10

The current set of standards that is used by BIOS,hardware,and the OS to manage power is ____.

A)Advanced Connection and Programming Interface
B)Advanced Configuration and Programming Interface
C)Advanced Connection and Power Interface
D)Advanced Configuration and Power Interface

Question 11

Intel's current families of processors for the desktop include four major groups: ____.

A)the Pentium, the Phenom, the Celeron, and the Atom families
B)the Core, the Pentium, the Celeron, and the Atom families
C)the Sempron, the Core, the Celeron, and the Atom families
D)the Core, the Pentium, the Celeron, and the Molecule families

Question 12

Electronic devices are more likely to fail than fans.

Question 13

Excessive heat can damage the CPU and the motherboard.

Question 14

The cooler sits on top of the processor and consists of a fan and a heat ____,which are fins that draw heat away from the processor.

A)dump
B)pipe
C)pump
D)sink

Question 15

Most cases have one or more positions on the case to hold a case fan to help draw air out of the case.

Question 16

The peltier's bottom surface can be as cool as ____ degrees F.

A)45
B)150
C)375
D)500

Question 17

An overheated system can cause intermittent problems or cause the system to reboot or refuse to boot.

Question 18

Memory in the processor package,but not on the processor die,is called ____ cache.

A)Level 1
B)Level 2
C)Level 3
D)Level 4

Question 19

If you hear two beeps during the boot and you see a blank screen,then BIOS has successfully completed POST.

Question 20

Intel's ____ allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.

A)Hyper-Execution
B)Multi-Threading
C)HyperTransport
D)Hyper-Threading

Question 21

The CMOS battery failure can be reported by startup BIOS during the ____.

A)firmware
B)OST
C)POST
D)Self Test

Question 22

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
Used by the processor to stop its internal operations to conserve power

Question 23

The temperature inside the case should not exceed ____ degrees C.

A)27
B)38
C)57
D)100

Question 24

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
Groups of instructions that accomplish fundamental operations

Question 25

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
Small holding areas on the processor chip that work much as RAM does outside the processor

Question 26

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
RAM that holds data and instructions that the memory controller anticipates the processor will need next

Question 27

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
Items that can be exchanged without returning the motherboard to the factory

Question 28

Intel and AMD both recommend a ____ air guide as part of the case design.

A)platform
B)component
C)power supply
D)chassis

Question 29

Every Intel processor also has a specification number called a(n)____________________ number printed somewhere on the processor.

Question 30

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
The speed at which the processor operates internally

Question 31

Processors can sense their operating temperatures and report that information to ____.

A)BIOS
B)CMOS
C)RAM
D)CPU

Question 32

When you hear ____ during post,you know that you have a problem with serial or parallel ports or system timer,which probably means the motherboard must be replaced.

A)Two beeps
B)Three beeps followed by three, four, or five beeps
C)Four beeps followed by two, three, or four beeps
D)One beep followed by three, four, or five beeps

Question 33

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
Running a motherboard or processor at a higher speed than the manufacturer suggests

Question 34

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
The portion of the internal bus that connects the processor to the internal memory cache

Question 35

When you hear ____ during post,you know that a keyboard controller failed or video controller failed.

A)Two beeps
B)Three beeps followed by three, four, or five beeps
C)Four beeps followed by two, three, or four beeps
D)One beep followed by three, four, or five beeps

Question 36

If a specific component is giving an error message,update its ____________________.

Question 37

Before opening the case of a brand name computer,such as a Gateway or Dell,consider the ____________________.

Question 38

Today's processors have technologies that put the processor in a(n)____________________ state when they are inactive.

Question 39

If the system refuses to boot or hangs after a period of activity,suspect ____________________.

Question 40

Match each term with the correct statement below.
a.Field replaceable units
f.Overclocking
b.Processor frequency
g.C states
c.Memory cache
h.Back-side bus
d.Registers
i.Microcode
e.P states
Save power by lowering the CPU frequency and voltage

Question 41

List and describe the three basic components of a processor.

Question 42

Explain the purpose of throttling.

Question 43

Describe a chassis air guide.

Question 44

List three symptoms of system overheating.

Question 45

Explain field replaceable units.

Question 46

Describe the AMD processors.

Question 47

Describe symptoms that indicate that a motherboard or processor is failing.

Question 48

Discuss why a case needs room to breathe.

Question 49

If you try all of the basic things to correct an overheating problem,describe more drastic solutions that you can attempt.

Question 50

Describe how a case is designed for optimal airflow.