Deck 3: Colloids, Fiber Fabrication, Thin Film Technology, and Electroplating
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Deck 3: Colloids, Fiber Fabrication, Thin Film Technology, and Electroplating
1
During an experiment, accidently iodine got mixed up with a biological sample of proteins and polys. Identify the smallest colloid that can be obtained during the process of separation.
A)fats
B)amino acids
C)polys
D)r molecules
A)fats
B)amino acids
C)polys
D)r molecules
amino acids
2
Which of the following form of colloid is considered to be the strongest colloid?
A)gel
B)foam
C)solid sol
D)liquid sol
A)gel
B)foam
C)solid sol
D)liquid sol
solid sol
3
Which of the following form of colloid is considered to be the lightest colloid?
A)gaseous foam
B)solid sol
C)sol
D)liquid sol
A)gaseous foam
B)solid sol
C)sol
D)liquid sol
gaseous foam
4
What is the size of normal an amino acid?
A)1 to 2 nm
B)2 to 3 nm
C)4 to 5 nm
D)2 to 5 nm
A)1 to 2 nm
B)2 to 3 nm
C)4 to 5 nm
D)2 to 5 nm
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5
What is called a dispersion phase?
A)it is the main layer
B)it is the secondary layer in which the colloidal particles are dispersed
C)it is the secondary layer
D)it is the basic colloidal layer
A)it is the main layer
B)it is the secondary layer in which the colloidal particles are dispersed
C)it is the secondary layer
D)it is the basic colloidal layer
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6
What is called a dispersion medium?
A)it is where the dispersed phase settles
B)it is where the solute particles settle
C)it is where the dispersed phase is suspended
D)it is the primary medium
A)it is where the dispersed phase settles
B)it is where the solute particles settle
C)it is where the dispersed phase is suspended
D)it is the primary medium
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7
When does an integrated circuit exhibit greater degree of freedom and electrical performance?
A)in thin and thick film technology
B)in semiconductor technology
C)in semiconductor and films technology
D)in thick film technology only
A)in thin and thick film technology
B)in semiconductor technology
C)in semiconductor and films technology
D)in thick film technology only
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8
Give the thickness range of the film used in thin film technology
A)0.5-2.5 mils
B)0.02-8 mils
C)10-20 mils
D)0.05-0.0 7mils
A)0.5-2.5 mils
B)0.02-8 mils
C)10-20 mils
D)0.05-0.0 7mils
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9
Which technology is used to get cheap resistors and capacitors?
A)thick film technology
B)thin film technology
C)thin and thick film technology
D)none of the mentioned
A)thick film technology
B)thin film technology
C)thin and thick film technology
D)none of the mentioned
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10
How is the process of film deposition carried out in cathode sputtering?
A)slower than evaporation method
B)faster than evaporation method
C)similar to same as evaporation method
D)all of the mentioned
A)slower than evaporation method
B)faster than evaporation method
C)similar to same as evaporation method
D)all of the mentioned
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11
How a uniform film with good crystal structure is attained in cathode sputtering process?
A)by hitting high energy particle directly on the substrate
B)allowing less time for the particles to deposit on the substrate
C)high energy particle diffuse through low pressure gas and deposits on the substrate
D)heavy inert gas is used for film deposition on the substrate
A)by hitting high energy particle directly on the substrate
B)allowing less time for the particles to deposit on the substrate
C)high energy particle diffuse through low pressure gas and deposits on the substrate
D)heavy inert gas is used for film deposition on the substrate
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12
Which process is used to deposit metals on glass, ceramic and plastic?
A)silk plating technique
B)gas plating technique
C)electroless plating technique
D)electroplating technique
A)silk plating technique
B)gas plating technique
C)electroless plating technique
D)electroplating technique
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13
Electroplating technique is suitable for
A)making conduction films ceramic
B)coating with considerable thickness
C)coating without use of electric current
D)making conduction films of gold or copper
A)making conduction films ceramic
B)coating with considerable thickness
C)coating without use of electric current
D)making conduction films of gold or copper
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14
Which of the following process is involve in thick film technology
A)screen printing
B)ceramic firing
C)silk screening
D)all of the mentioned
A)screen printing
B)ceramic firing
C)silk screening
D)all of the mentioned
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15
An ancient process used till today for production of circuit films is,
A)silk screening technique
B)surface mount technology
C)ceramic printing technique
D)screen printing technique
A)silk screening technique
B)surface mount technology
C)ceramic printing technique
D)screen printing technique
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