Question 1

The surface of the device and heat sink may look perfectly flat to the naked eye.

Accepted Answer

Even if surfaces appear perfectly flat to the naked eye, at the microscopic level, they contain irregularities and imperfections that can affect thermal contact and heat transfer efficiency.

Question 2

When a component is mounted to a heat sink, ____ is generally used to ensure a good thermal contact&#160; between the device and the heat sink.&#10;A) thermal compound&#10;B) insulation compound&#10;C) resistance compound&#10;D) break compound

Accepted Answer

Thermal compound is used to ensure a good thermal contact between the device and the heat sink because it fills in air gaps and imperfections on the surfaces, improving heat transfer.

Question 3

Heat sinks vary in size and shape, but have only one purpose.

Accepted Answer

Heat sinks are designed to dissipate heat away from electronic components to prevent overheating, regardless of their size or shape.

Question 4

Using thermal compound when heat sinking components is not a necessity.

Accepted Answer

Thermal compound improves the thermal conductivity between the component and the heatsink by filling in microscopic imperfections on the surfaces, ensuring efficient heat transfer.

Question 5

The thermal compound that is greasy and generally white in color is made from ____.&#10;A) sodium oxide&#10;B) magnesium peroxide&#10;C) beryllium perchlorate&#10;D) beryllium oxide

Accepted Answer

The thermal compound that is greasy and generally white in color is often made from beryllium oxide. Beryllium oxide is used in some thermal interface materials due to its high thermal conductivity and electrical insulating properties.

Question 6

Small heat sinks are generally used when a component is operated at its lowest power rating.

Accepted Answer

Heat sinks are used to dissipate heat from components, and their size is determined by the amount of heat that needs to be dissipated, not the power rating at which the component is operated. Components operating at lower power may generate less heat, but the size of the heat sink is based on the maximum heat generation expected, not the operational power level.

Question 7

The purpose of a heat sink is to decrease the surface area of the device connected to it.

Accepted Answer

The purpose of a heat sink is to increase the surface area in contact with the cooling medium, such as air, to dissipate heat more effectively from the device it is attached to.

Question 8

Electrical and electronic components have a power rating measured in ____.&#10;A) volts&#10;B) ohms&#10;C) watts&#10;D) amps

Accepted Answer

The power rating of electrical and electronic components is measured in watts, which is a unit of power indicating the rate of energy consumption or generation.

Question 9

The ____ rating indicates the amount of heat that the component can dissipate before damage occurs.&#10;A) power&#10;B) energy&#10;C) resistance&#10;D) current

Accepted Answer

The power rating of a component indicates the maximum amount of power it can handle or dissipate without sustaining damage.

Question 10

____ is used to fill in the gaps between the two surfaces and provide good thermal contact.&#10;A) Insulation compound&#10;B) Thermal compound&#10;C) Break compound&#10;D) Lock compound

Accepted Answer

Thermal compound is used to fill in the gaps between two surfaces, such as a CPU and its heatsink, to enhance thermal conductivity and ensure efficient heat transfer.

Deck 2: Power Rating and Heat Sinking Components