Which of the following polymeric materials is commonly used as an ingredient in the insulation layer of a printed circuit board (two correct answers) :
A) copper
B) E-glass
C) epoxy
D) phenolic
E) polyethylene
F) polypropylene
Correct Answer:
Verified
Q1: The first level of packaging refers to
Q2: Surface-mount technology is used at which one
Q3: Card-on-board (COB) packaging refers to which one
Q5: Typical thickness of the copper layer in
Q6: Several types of holes must be created
Q7: Which of the following plating processes has
Q8: In addition to copper, which one of
Q9: In the subtractive circuitization method used to
Q10: The solder paste and reflow soldering method
Q11: In the solder paste and reflow soldering
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