Heat sink compound may be used to provide both a thermal connection and a mechanical connection.

Name: Heat sink compound may be used to provide both a thermal connection and a mechanical connection.
Brand: Quizplus
Rating: 4.8 (37 reviews)

Question

Quizplus · Accepted Answer

Heat sink compound, also known as thermal paste, is used to improve thermal connection between surfaces, such as between a CPU and its heat sink, but it does not provide a mechanical connection. Mechanical stability is usually achieved through other means, such as clips, screws, or brackets.

Heat Sink Compound May Be Used to Provide Both a Thermal