Which of the following processes are used to add layers of various materials in IC fabrication (three best answers):
A)chemical vapor deposition,
B)diffusion
C)ion implantation
D)physical vapor deposition
E)plasma etching
F)thermal oxidation
G)wet etching

Question

Quizplus · Accepted Answer

Chemical vapor deposition (A) and physical vapor deposition (D) are techniques used to deposit thin films of various materials onto a substrate, which is a common step in IC fabrication. Thermal oxidation (F) is a process used to grow a layer of silicon dioxide on the surface of a silicon wafer, which is crucial for creating the insulating layers needed in semiconductor devices.

Which of the Following Processes Are Used to Add Layers