Which one of the following technologies in IC packaging provides the greater packing densities in circuit board assembly:
A)pin-in-hole technology,
B)surface-mount technology
C)through-hole technology

Question

Quizplus · Accepted Answer

Surface-mount technology (SMT) allows for greater packing densities because components are mounted directly onto the surface of a printed circuit board, allowing for more components to be placed on the board compared to pin-in-hole or through-hole technologies, where components must pass through holes in the board.

Which One of the Following Technologies in IC Packaging Provides