Which one of the following IC packaging styles provides the opportunity for the largest number of terminals in the package:
A)ball grid array,
B)dual in-line package
C)pin grid array
D)square package

Question

Quizplus · Accepted Answer

both (a) and (c) use a square matrix of leads, but a is (a) surface-mount package which is capable of closer spacing of the leads than (c) which is a pin-in-hole package

Which One of the Following IC Packaging Styles Provides the Opportunity